***New Product For Licensing, Manufacturing, and/or Investors***

U.S. Patents: # 6,612,905, #6,645,049, # 6,666,948, # 6,733,367

Inventor : Phuong Van Nguyen

As attorney for the inventor of the innovative Silicon Wafer Polishing Holder we are currently seeking manufacturing companies to license, purchase patent rights or enter into a royalty agreement for this timely invention.

The Silicon Wafer Polishing Holder relates generally to devices for polishing workpieces and more specifically to a device for polishing silicon wafers including a planar template having a plurality of cavities wherein a silicon wafer is placed for polishing to a thickness equivalent to the depth of the template cavity.

Objects of the present invention:

• to provide a method and apparatus for lapping and polishing silicon wafers that can be used repeatedly
  
  
• to provide a method and apparatus for lapping and polishing silicon wafers wherein the apparatus includes templates substantially comprised of fiberglass-epoxy laminates and have a frictionless backing material adhesively affixed thereto
  
  
• to provide a method and apparatus for lapping and polishing silicon wafers having a plurality of shims preferably manufactured from a suitable material such as polyurethane
  
  
• to provide a method and apparatus for lapping and polishing silicon wafers wherein the shim is affixed to the base of the plurality of cavities within said template thereby adjusting the depth of the cavity
  
  
• to provide a method and apparatus for lapping and polishing silicon wafers wherein the template can be used to produce wafers of various and/or calculated thickness
  
  

Now for the first time this unique product is available for millions of potential users.

LIST OF REFERENCE NUMERALS 10 present invention 12rotating pneumatic heads 36 mainplate 14 lapping and polishing surface 38 base of cavity 16workpiece template 40 mylar layer 18 tube 42 adhesive layer 20supple of moistening liquid 44 aperture in main disk 22 top side of lapping and polishing surface 46 adhesive layer 24arrows indicating rotation of the rotating pneumatic head 48 holding disk 26 cavity within workpiece template 50 wafer 28bottom surface of workpiece template 52 portion of wafer remaining after lapping and polishing 30 shim 54 portion of wafer removed by lapping and polishing 32top side of the workpiece template 56 plurality of grooves extending along the top surface of main plate 34 backing plate 58 center of workpiece template

PATENT DRAWINGS FIGURE 1 Figure 1 is a perspective view of the silicon wafer polishing holder of the present invention. FIGURE 2 Figure 2 is a bottom side view of a workpiece template used with the silicon wafer polishing holder. FIGURE 3 Figure 3 is a perspective view of the workpiece template of the present invention. FIGURE 4 Figure 4 is a cross sectional view of the workpiece of the present invention. FIGURE 5 Figure 5 is an exploded view of the workpiece template of the present invention. FIGURE 6 Figure 6 is a top exploded view of a holding disk of the present invention. FIGURE 7 Figure 7 is a perspective view of a plurality of color-coded shims for use with the present invention. FIGURE 8 Figure 8 is an exploded view of the workpiece cavity of the silicon wafer polishing holder. FIGURE 9 Figure 9 is an exploded view of a workpiece cavity of the silicon wafer polishing holder of the present invention including a shim positioned therein for adjusting the depth of the cavity. FIGURE 10 Figure 10 is an exploded view of the workpiece cavity including a plurality of shims positioned therein for adjusting the depth of the cavity. FIGURE 11 Figure 11 is a bottom side view of the workpiece template showing workpiece cavities in exploded form. FIGURE 12 Figure 12 is a cross-sectional view of a workpiece cavity of the silicon wafer polishing holder of the present invention. FIGURE 13 Figure 13 is a cross-sectional side view of the silicon wafer polishing holder of the present invention including more than one shim within the cavity. FIGURE 14 Figure 14 is a bottom side view of the workpiece template of the present invention. FIGURE 15 Figure 15 is a bottom side view of an alternate workpiece template embodiment for use within the silicon wafer polishing holder of the present invention. FIGURE 16 Figure 16 is a perspective view of an alternate embodiment of the silicon wafer polishing holder of the present invention.

If you are interested in licensing, purchasing the rights to the above invention or entering into a royalty agreement please contact the office of Michael I. Kroll as follows:

Michael I. Kroll
80 Skyline Drive, Suite 304
Plainview, New York 11803
Tel. #: 800-367-7774
Tel. #: 516-367-7777
Fax #: 800-367-7999
Fax #: 516-802-0510

E-Mail patent@invention.net